4th Metallization Workshop

Constance, Germany

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Monday, May 6th, 2013

from 20:00 Welcome Reception and Pre-Registration

Tuesday, May 7th, 2013

8:00 - 9:00 Registration
9:00 - 9:10 Opening
9:10 - 10:40 Session I: Formation of Screenprinted Contacts I
Rene Hoenig Fraunhofer ISE Investigating the nature of screen printed front side silver contacts - Aims and results of the research project MikroSol
Steve Olweya Fraunhofer ISE Fineline silver pastes for seed layer screen printing with varied glass content
Joo-Youl Huh Korea University Electrochemical study of Ag ionization in molten lead borosilicate glass during screen-printed Ag contact formation
Stefan Körner Fraunhofer IKTS Impact of glass on shrinkage rate of glass-containing silver powders and silver precipitations in PV frontside metallizations
10:40 - 11:10 Coffee break
11:10 - 12:40 Session II: Silver Reduction
Dominik Rudolph ISC Konstanz Replacement of silver in silicon solar cell metallization pastes: Is it possible?
Christian Muschelknautz Heraeus Standard Printing Technique - Pushing the envelope to 75 mg paste per cell on the Front Side
Lars Hamann IPE Stuttgart 30% Silver Reduction in rear bus bar metallization
Marco Balucani Uni Roma New selective processing technique for solar cell
12:40 - 13:50 Lunch break
13:50 - 15:20 Session III: Simulation and Characterisation
Johnson Kai Chi Wong SERIS - NUS Griddler: Advanced solar cell metallization simulation and Computer Aided Design
Frode Klow IFE Norway Surface recombination velocity measurements of metallized surfaces by photoluminescence imaging
Fumihiko Yamada Toyota Technological Institute Workfunction mapping of Si-metal paste interface on an atomic scale using KFM
Lejo Koduvelikulathu ISC Konstanz Two-dimensional modelling of the metallization induced recombination losses for screen printed solar cells
15:20 - 15:50 Coffee break
15:50 - 17:20 Session IV: Ni/Cu Plated Contacts
Jean-François Lerat EXCICO Correlation between SiNx laser ablation and nickel silicide formation by Excimer laser annealing for two steps Ni-Cu metallization
Jonas Geissbühler STI PVLAB - EPFL Neuchâtel Electrodeposited copper front metallization for High-efficiency silicon heterojunction solar cells
Byungjun Kang SERC Korea Copper front electrode in crystalline silicon solar cells fabricated by cold spray deposition
Ian Bennet ECN Compatibility of copper plated cells with MWT module technology
17:20 - 17:50 Coffee break
17:50 - 18:20 Debate
From 18:45 Aperitif and Dinner

Wednesday, May 8th, 2013

9:00 - 10:30 Session V: Formation of Screenprinted Contacts II
Michael Rauer Fraunhofer ISE Investigation of aluminum-boron doping profiles formed by coalloying of screen-printed paste
Marco Balucani Uni Roma Aluminum-Silicon interdiffusion in screen printed metal contacts for silicon based solar cells applications
Thomas Buck ISC Konstanz Contact formation on p+ surfaces by thick film Ag metallization
Eric Kossen ECN Cost reduction by improved metallization of n-Pasha cells
10:30 - 11:00 Coffee break
11:00 - 12:30 Session VI: From Cells to Modules
Andreas Schneider ISC Konstanz Conductive adhesives as interconnection technology for busbar- and pad-free solar cells
Stefan Braun University of Konstanz Multi-busbar approaches for solar cell and module optimization
Verena Jung ISFH Hameln Solder joints on a Ni based PVD-metallization for silicon solar cells
Pierre Papet Roth & Rau Research Front grid metallization and module interconnections of industrial silicon heterojunction solar cells
12:30 - 13:30 Lunch break
13:30 - 15:00 Session VII: Fine Line Printing
Helge Hannebauer ISFH Hameln High efficiencies and low Ag paste consumption obtained with ultra-fineline printing
Masashi Nakayama Kyoto Elex Co., Ltd Lead-free silver-paste for fine-line printing with ultra-fine mesh screen
Claudia Bottosso Applied Materials Reliable metallization process for ultra fine line printing
Maximilian Pospischil Fraunhofer ISE Process development for a high-throughput fine line metallization approach based on dispensing technology
15:00 - 15:15 Closing
15:15 - 15:45 Coffee and Good Bye
Dow Corning
ISC Konstanz Universität Konstanz
Fraunhofer ISE